產(chǎn)品描述 杜邦?ME902是杜邦開發(fā)的用于開發(fā)的材料套件的一部分 模內(nèi)電子應(yīng)用。 ME902是導(dǎo)電的 用于模版印刷和注射器分配的粘合劑系統(tǒng) 應(yīng)用程序。其獨特的配方可提供良好的附著力 熱固化后的SMD組件和杜邦銀導(dǎo)電膠。 杜邦?ME902干燥后仍保持一定的柔韌性，可實現(xiàn) 在薄基板上處理和熱成型IME電路。它 包覆成型后保持其特性。 產(chǎn)品優(yōu)點 ?一部分導(dǎo)電膠 ?對于IME應(yīng)用具有良好的附著力和柔韌性 ?熱成型和包覆成型后的優(yōu)異性能 ?通過模版印刷或注射器分配進(jìn)行涂覆 處理方式 基材 杜邦在聚碳酸酯或表面處理過的聚酯上的銀漿 應(yīng)用設(shè)備兼容性* ?臺式或機(jī)器人EFD流體分配系統(tǒng) ?模版印刷 ?絲網(wǎng)印刷（需要稀釋） *《 ME902工藝指南》中的其他信息

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PRODUCT DESCRIPTION DuPont? ME902 is a part of the DuPont suite of materials developed for In-Mold Electronic applications. ME902 is an electrically conductive adhesive system for use in stencil-printing and syringe-dispensing applications. Its unique formulation provides good adhesion between SMD components and DuPont silver conductive pastes after heat curing. DuPont? ME902 maintains some flexibility after drying, which enables handling & thermoforming of IME circuits on thin substrates. It maintains its properties after over-molding. PRODUCT BENEFITS ? One part electrically conductive adhesive ? Good adhesion with flexibility for IME applications ? Excellent performance after thermoforming & over-molding ? Apply via stencil-printing or syringe-dispensing PROCESSING Substrates DuPont silver pastes on polycarbonate or surface-treated polyester Application Equipment Compatibility* ? EFD Fluid Dispensing Systems, bench-top or robotic ? Stencil-printing ? Screen-printing (thinning is required) *Additional information in ME902 Process Guide